3-D Tour of Integrated Circuits at the Nanometer Scale

Posted in Journal Articles on March 30, 2018 at 9:30 pm by JCCMP

High-resolution non-destructive three-dimensional imaging of integrated circuits
Authors: Mirko Holler, Manuel Guizar-Sicairos, Esther H. R. Tsai, Roberto Dinapoli, Elisabeth Müller, Oliver Bunk, Jörg Raabe, and Gabriel Aeppli
Nature 543, 402 (2017)

Recommended with a commentary by J. B. Hastings, SLAC National Accelerator Laboratory.
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